XILINX Virtex FPGAs


XILINX Virtex-II Pro


Virtex-II Pro™ 和Virtex-II Pro X FPGAs相对于其他的FPGA具有更多的容量和性能。

在这样一部单独的器件中， 您就能得到更多的逻辑、更强的性能、容量、存储而无附加费用，另外还有IBM 400MHz PowerPC™处理器和622Mbps 到10.3125 Gbps的双向串联收发器。这些优势让您获取显著的生产效率和超凡的效益。而且Xilinx作为提供130 nm， 300 mm生产FPGAs的独家厂商，会为您提供更加经济的解决方法。

  • 基于一张130 nm和9层铜板的加工工艺
  • 3K 到99K逻辑单元
  • 400+ MHz 时钟频率
  • 较以前的科技更高性能和更低消费
  • 无与伦比的理想化，具有更多的逻辑单元更低的单元消耗
  • 最高测量性和最广的选择面
  • 可调整的特性、容量、I/O、和性能比
  • 嵌入式和分布式存储器
  • 针对on-chip/off-chip时钟合成和同步的数字时钟管理
  • 数字式控制I/O阻抗提高了信号的完整性同时减少主板空间
  • 完全或部分FPGA的再组合为您提供更坚固的产品
  • 近20部完全双向串联收发器
  • 在Virtex-II Pro上622Mbps到3.125 Gbps的完全双向RocketIO串联收发器
  • 在Virtex-II Pro X上2.488Mbps到10.3125 Gbps的完全双向RocketIO X串联收发器
  • Single-ended and differential electrical I/O enable complete parallel connectivity
  • TeraMAC/s DSP Performance
  • Up to 444 18X18 embedded multipliers
  • Extensive library of DSP algorithms
  • DSP tools such as The MathWorks MATLAB™/Simulink™, the Xilinx System Generator for DSP, and Cadence SPW
  • Up to two 400MHz, 600+ DMIPS embedded IBM PowerPC 405 Processor hard cores
  • Industry's fastest soft processing solution with MicroBlaze™ core
  • Easiest tools for programmable logic and embedded software
  • 6x faster compile times than closest alternative
  • Over 200 IP cores from Xilinx and partners
  • Real time debug using ChipScope™ Pro tools
  • Only vendor to ship 130 nm/300 mm production FPGAs
  • Lowest costs for development, verification, prototype, and production
  • Up to 80% cost reduction for high volume production with Virtex-II Pro EasyPath solution
  • Cut system costs significantly by using the Virtex-II Pro family features and tools that simplify designs at even board and box levels
  • Proven interoperability enables you to choose the best suitable ASSPs

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XILINX Virtex-4


Breakthrough Performance at the Lowest Cost

Xilinx has once again set the standard for high-performance FPGAs. The Virtex-4™ family of platform FPGAs provides the most advanced logic, highest performance, highest density, and greatest memory capacity. With 200,000 logic cells, 500 MHz performance, and unrivaled system features, the Virtex-4 devices deliver twice the density, twice the performance, and half the power consumption of any other FPGA family.

Multiple Platforms-Freedom to Choose

The Virtex-4 family offers three platforms with a total of seventeen devices tailored to the requirements of different application domains. Our multiple platforms enable you to select the device that most cost-effectively implements your unique application; you pay only for the capabilities you need.

LX - High-performance logic
Highest logic-to-feature ratio
Highest I/O-to-feature ratio
SX - Ultra-high-performance signal processing
Highest DSP-to-feature ratio
Highest memory-to-feature ratio
FX - Embedded processing and high-speed serial connectivity
Embedded IBM PowerPC™ processor and Ethernet MAC
RocketIO™ multi-gigabit serial transceivers

  • Simplify source-synchronous interfacing with ChipSync technology built into every I/O
  • Support the widest range of serial I/O standards with 24 full duplex RocketIO transceivers and pre-verified IP
  • Simplify board design with XCITE active I/O termination (series, parallel, differential) technology
  • Build area-efficient, high-performance embedded systems or complex control functions with hard and soft processor cores
  • Design with embedded IBM PowerPC 405 processors
  • Simplify hardware acceleration and co-processing with the new Auxiliary Processor Unit (APU) controller for the PowerPC processor
  • Select from a variety of soft IP cores, including 32-bit MicroBlaze processor, 8-bit PicoBlaze controller, IBM CoreConnect busses, and peripherals developed by Xilinx and partners
  • Solve multi-channel and ultra-high-performance DSP challenges with the new XtremeDSP slice
  • Build real-time video, imaging, wireless, and encryption systems
  • Up to 512 Xtreme DSP slices can be cascaded in a column with consuming additional logic resources
  • 500 MHz System Clocking
  • 1+ Gbps SelectIO parallel I/O
  • 622 Mbps-11.1 Gbps RocketIO transceivers
  • 256 GMACS (18x18) Digital Signal Processing cicuitry
  • 450 MHz, 680 DMIPS PowerPC processing-up to 1,360 DMIPS in a single device
  • 200,000 Logic Cells: implement large SoC designs
  • Embedded Functionality: increase effective logic capacity and decrease device cost
  • Reduced Power Consumption